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Substrate with embedded components - List of Manufacturers, Suppliers, Companies and Products

Substrate with embedded components Product List

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Component-integrated board SIMPACT [Reducing dead space for miniaturization!]

Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!

Recently, in response to the miniaturization and high density of electronic devices, there is a demand for the miniaturization and integration of printed circuit boards. The technology of embedded substrate, which reduces the surface area for component mounting by embedding components within the circuit board and minimizing dead space, is being sought after. SIMPACT is accepting orders for prototypes of embedded substrates. Please feel free to inquire from just one piece. 【Features】 ■ Components can be mounted at low temperatures and in a short time ■ Reduced load on components due to a dry process that eliminates the need for drilling and copper plating after mounting ■ Technology that connects wiring between different layers at arbitrary positions, enabling the shortest possible wiring formation ■ Vertical embedding allows for the embedding of many chips *For details, please request materials or view the PDF data from the download.

  • Printed Circuit Board

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3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMS

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